Infineon and Delta Collaborate on High-Density Power Modules to Accelerate Data Center Power Architecture

Infineon Technologies AG announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of enabling vertical power delivery to AI processors in hyperscale data centers. Together, the companies are taking a next step to drive decarbonization and digitalization in AI data centers further.

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The partnership leverages Infineon’s ultra-thin silicon (MOSFET) chip technology and embedded packaging expertise, as well as Delta’s industry-leading power module design and manufacturing capabilities. This results in highly dense modules with exceptional efficiency to enable vertical power delivery (VPD) architecture to the xPUs in hyperscale data centers. The usage of vertical power delivery modules in comparison to a lateral mounted discrete solution can save up to 150 tons of CO2 over an expected lifetime of three years per rack. Assuming that future hyperscale data centers will consists of up to 100 server racks, the amount of carbon dioxide saved is equivalent to the CO2 emissions of 4000 households per year.