Henkel’s Low-Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding.
Various Process Advantages
Technomelt Low-Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialised polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, the risk of damage to the electronics during the encapsulation process is far lower.
The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid components. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.
This story is from the Aug-Sept 2021 edition of ET Polymers.
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This story is from the Aug-Sept 2021 edition of ET Polymers.
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