A*Star Banks on Deep Tech Ecosystem in Innovation Drive

Through open innovation, the agency collaborates with partners to shape the next frontier of scientific and technological capabilities to power Singapore's future economy. By Melvin Yong

- By Melvin Yong

Singapore's rise as a science and technology powerhouse owes much to a national commitment to relentless innovation.

And for decades, the key institution fuelling the nation's ambition is the Agency for Science, Technology and Research (A*Star), established in 1991. From chip-fabrication breakthroughs to vaccine manufacturing and next-generation aviation technology, A*Star has spent decades turning lab research into economic muscle.

Now, as global supply chains shift in a disrupted and uncertain world, A*Star's work and global partnerships are more vital than ever.

Singapore's semiconductor sector is globally recognised as a cornerstone of its industrial strength—accounting for more than 7 per cent of gross domestic product.

The country is also ranked among the world's top locations for wafer fabrication. A*Star has played a critical role in building the technological foundations underpinning that success.

ENABLING STRATEGIC SECTORS

Over the past two decades, the value-added contribution of electronics manufacturing has nearly doubled from 45.6 per cent to 86.4 per cent, according to figures from the Ministry of Trade and Industry.

This shift reflects the impact of upstream research and development (R&D) and capability development, including A*Star's work in areas such as advanced packaging, photonics, piezoelectric microelectromechanical systems or piezo-Mems (microchips that react to touch and motion), gallium nitride and silicon carbide.

One of the most significant collaborations has been with US semiconductor equipment giant Applied Materials.

The partnership was elevated in 2011 with a master research collaboration agreement between Applied Materials and A*Star's Institute of Microelectronics to launch the Centre of Excellence in Advanced Packaging to develop advanced 3D chip-packaging capabilities.