Try GOLD - Free
Innovative Lessons From Ladakh For Rest Of The World
Electronics For You
|September 2022
While the world wants to indigenise high-tech, Ladakh uses simple, local technologies to solve most of the problems. From solar-powered houses to mountain-to-mountain connectivity, Ladakh shows how simple methods can achieve huge milestones. This is a story not just about sustainable but regenerative development

Living in Ladakh might seem like living in a remote part of the planet, especially when people feel cut-off from rest of the world for up to seven months in a year. With roads blocked due to heavy snow, landlocks exist in Ladakh till May or June every year, showing how remote the place is.
While problems vary from place to place and terrain to terrain, everyone is looking for simple and local solutions here to indigenise and solve them. Sonam Wangchuk from Ladakh believes, it would be interesting to know how the same science is being applied differently in Ladakh. He further explains how new digital technologies can be used to connect mountains, marking a huge milestone in network and connectivity.
Ladakh, located on the northernmost part of India, across the Himalayas, is quite a high and dry place with temperatures ranging from -35°C to +35°C from winter to summer. Situated on the Tibetan plateau—the rooftop of the world—this place is as close as it can get to outer space while still being on planet Earth. In terms of climate, Ladakh is considered a rarity, since when water freezes, problems like freezing, blockages, and bursting open of pipes happen. Yet, Ladakh is a thriving hub of innovation and problem solving.
Solar-powered houses
This story is from the September 2022 edition of Electronics For You.
Subscribe to Magzter GOLD to access thousands of curated premium stories, and 9,500+ magazines and newspapers.
Already a subscriber? Sign In
MORE STORIES FROM Electronics For You
Electronics For You
Low-power, reliable transmitter chip
Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.
1 min
September 2025

Electronics For You
Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS
Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...
5 mins
September 2025

Electronics For You
Compact swarm-level AI drones navigation using neural network
Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.
1 min
September 2025

Electronics For You
ML-based wireless power transfer
Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.
1 min
September 2025
Electronics For You
Wi-Fi that knows who you are
WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.
1 min
September 2025

Electronics For You
3mm-thick holographic display that delivers lifelike 3D visuals
Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.
1 min
September 2025

Electronics For You
Smart Trolley Robot 'TROLL.E 1.0'
Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.
3 mins
September 2025
Electronics For You
Compact metal-free thin-film supercapacitor delivers 200V
GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.
1 min
September 2025

Electronics For You
Al-powered self-driving lab tests materials 10x faster
Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.
1 min
September 2025

Electronics For You
Breakthrough in co-packaging photonic and electronic chips
The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.
1 min
September 2025
Translate
Change font size