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Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset
Circuit Cellar
|July 2026
Rambus Inc., a premier chip and silicon IP provider making data faster and safer, announced a SOCAMM2 (Small Outline Compression Attached Memory Module) chipset designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms.
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The SOCAMM2 chipset represents the first step in a broader Rambus roadmap of LPDDR-based server module solutions, reflecting the company's ongoing collaboration with industry partners to support new memory architectures optimized for evolving workloads in AI data center infrastructure. This new product family extends the comprehensive Rambus offering of complete memory interface chipsets for all JEDEC-standard DDR5 and LPDDR5 memory modules.
This story is from the July 2026 edition of Circuit Cellar.
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