The Architecture Behind Intelligence: Designing the Future of Semiconductor Packaging

The semiconductor industry is undergoing a profound transformation as the world moves into what many describe as the “convergence era” — a phase where digital systems, physical infrastructure, and biological environments increasingly intersect.

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At the heart of this shift lies semiconductor packaging, an area once seen as the final step of chip manufacturing but now recognized as a strategic enabler of performance, power efficiency, and system-level integration. Advanced packaging technologies are redefining how chips are interconnected, cooled, protected, and scaled — directly influencing breakthroughs across AI, cloud and edge computing, automotive electronics, next-generation connectivity, and more.

To understand the global inflection points shaping this space, we spoke with Mr. Ram Trichur, Global Head of Semiconductor Packaging at Henkel Adhesive Technologies. With Henkel playing a pivotal role in delivering advanced materials for high-density, high-performance, and heterogeneous chip designs, Mr. Trichur shares insights on market evolution, opportunities for innovation, sustainability priorities, and India's emerging position as a key semiconductor packaging hub.

What key global trends are currently shaping the semiconductor packaging industry?

We are living in a “convergence era,” where digital, physical, and biological systems, once distinct, are now merging and reshaping how we live, work, and communicate. This fusion is being driven by breakthroughs across multiple technological domains, including AI, advanced computing, power electronics, connectivity, and materials science. Semiconductor packaging serves as the key enabler for the high-performance semiconductor devices that power cloud and edge infrastructure, providing the structural and functional foundation for this convergence. It has become the critical link that translates these technological inflections into real-world capability.

Where do you see the biggest opportunities and challenges for packaging in the next 3-5 years?