A new chapter in tech self-reliance

India's journey toward technological sovereignty has reached an exciting milestone with the announcement of cutting-edge semiconductor facilities in Odisha.

- Bhagirathi Jena

The state is set to become the cradle of India’s semiconductor revolution, hosting the nation’s first commercial Silicon Carbide (SiC) chip manufacturing unit and a world-class advanced packaging facility in Bhubaneswar’s Info Valley. These projects, representing investments worth thousands of crores, mark a decisive shift in India's capabilities from being merely a consumer to becoming a creator of critical semiconductor technologies.

The numbers tell a compelling story. The SiC facility, collaboration between Indian company SicSem and UK-based Clas-SiC Wafer Fab, will produce 60,000 wafers annually with packaging capacity for 96 million units. To put this in perspective, these chips will power everything from our smartphones to our missile systems. The adjacent advanced packaging unit by 3D Glass Solutions will manufacture 69,600 glass panel substrates and assemble 50 million units each year. Together, these facilities will employ highly skilled professionals while creating numerous indirect employment opportunities across the supply chain.