Prøve GULL - Gratis
How Much Open Source Is TOO MUCH OPEN SOURCE?
Electronics For You
|March 2024
Intel's OpenVINO toolkit helps developers by streamlining code writing, freeing them to concentrate on other vital project aspects. AI Evangelist at Intel, Anisha Udayakumar, elucidates on OpenVINO's versatility

As its name implies, open source knows no bounds and extends even into proprietary hardware companies. Intel’s use of open source for model optimisation showcases its ability to nurture a wide array of products in the rapidly expanding field of artificial intelligence and machine learning. This approach has not only showcased the potential of open source but has also established a brilliant business model within a proprietary ecosystem.
With its open visual inference and neural network optimisation (OpenVINO) toolkit, tailored for developers, Intel trains computers to recognise patterns, quickly and accurately. Initially aimed at the computer vision market, this open sourced toolkit has expanded its versatility to optimise models to understand language or generate content (text or images) through artificial intelligence across various domains, including NLP, generative AI, and emerging large language models.
There is an abundance of open source toolkits in the field of deep learning and neural network optimisation. Whether it’s Facebook’s PyTorch for research, Keras for user-friendly applications, or Apache’s MXNet for unparalleled scalability, the question arises: What sets OpenVINO apart?
Denne historien er fra March 2024-utgaven av Electronics For You.
Abonner på Magzter GOLD for å få tilgang til tusenvis av kuraterte premiumhistorier og over 9000 magasiner og aviser.
Allerede abonnent? Logg på
FLERE HISTORIER FRA Electronics For You
Electronics For You
Low-power, reliable transmitter chip
Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.
1 min
September 2025

Electronics For You
Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS
Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...
5 mins
September 2025

Electronics For You
Compact swarm-level AI drones navigation using neural network
Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.
1 min
September 2025

Electronics For You
ML-based wireless power transfer
Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.
1 min
September 2025
Electronics For You
Wi-Fi that knows who you are
WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.
1 min
September 2025

Electronics For You
3mm-thick holographic display that delivers lifelike 3D visuals
Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.
1 min
September 2025

Electronics For You
Smart Trolley Robot 'TROLL.E 1.0'
Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.
3 mins
September 2025
Electronics For You
Compact metal-free thin-film supercapacitor delivers 200V
GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.
1 min
September 2025

Electronics For You
Al-powered self-driving lab tests materials 10x faster
Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.
1 min
September 2025

Electronics For You
Breakthrough in co-packaging photonic and electronic chips
The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.
1 min
September 2025
Listen
Translate
Change font size