Prøve GULL - Gratis
5G CONNECTIVITY For Motorsports
Electronics For You
|January 2023
The article explores the feasibility and design considerations for providing 5G connectivity for motorsports

There has been interest in the motorsports industry to provide 5G connectivity for the cars on track. Typically, the cars use legacy technologies like Wi-Fi or digital video broadcast (DVB) to provide the connectivity for backhauling telemetry, video, and audio data from the cars back to the pit and media centre for broadcasting.
However, the current solutions provide a limited bandwidth, and throughput is in the range of 10 to 12Mbps. This throughput is insufficient for advanced use cases and capabilities like 4K streaming, 360-degree video, and telemetry for the racing cars.
The automotive industry is also moving towards a software defined vehicle (SDV) strategy, where the cars will need a highly reliable and low latency connectivity for frequent updates to the software, and to push gigabytes of data from the hundreds of different sensors on the cars. The move to electrification and softwarisation also needs a connectivity solution that is future-proof and ready for these requirements and remain relevant for the next decade.
Hence the option of using private 5G networks to provide connectivity for the motorsports industry cars is an attractive proposition. 5G is an option for the motorsports industry as it is designed to overcome and mitigate some of the issues involved in using wireless communications technologies for the motorsports use cases.
Proposed solution architecture
The figure on previous page shows the proposed ORAN disaggregated architecture for the motorsports use case. The solution uses the 7.2 split architecture, which is modular and extensible for the motorsports use case.
In this architecture, the distributed units (DUS) run some of the physical layer algorithms besides the radio link control (RLC) and media access control (MAC) layers. The DUS are housed in the track side units (TSU), which also provide the power for the DUS.
Denne historien er fra January 2023-utgaven av Electronics For You.
Abonner på Magzter GOLD for å få tilgang til tusenvis av kuraterte premiumhistorier og over 9000 magasiner og aviser.
Allerede abonnent? Logg på
FLERE HISTORIER FRA Electronics For You
Electronics For You
Low-power, reliable transmitter chip
Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.
1 min
September 2025

Electronics For You
Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS
Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...
5 mins
September 2025

Electronics For You
Compact swarm-level AI drones navigation using neural network
Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.
1 min
September 2025

Electronics For You
ML-based wireless power transfer
Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.
1 min
September 2025
Electronics For You
Wi-Fi that knows who you are
WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.
1 min
September 2025

Electronics For You
3mm-thick holographic display that delivers lifelike 3D visuals
Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.
1 min
September 2025

Electronics For You
Smart Trolley Robot 'TROLL.E 1.0'
Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.
3 mins
September 2025
Electronics For You
Compact metal-free thin-film supercapacitor delivers 200V
GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.
1 min
September 2025

Electronics For You
Al-powered self-driving lab tests materials 10x faster
Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.
1 min
September 2025

Electronics For You
Breakthrough in co-packaging photonic and electronic chips
The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.
1 min
September 2025
Translate
Change font size