試す 金 - 無料
ASSISTIVE AI: Semiconductor Design, Manufacture, And Workforce
Electronics For You
|April 2024
Together, human intelligence and AI create a powerful synergy, highlighting the vital lesson for the semiconductor workforce: adapt to new technologies

The relationship between semiconductors and artificial intelligence (AI) is symbiotic and transformative. Semiconductors, the backbone of all modern electronics, have played a crucial role in developing and proliferating AI technologies. At the same time, AI has increasingly influenced how semiconductor products are designed and manufactured. This mutual growth cycle promises to push the boundaries of endless possibilities in technology, leading to faster, more innovative, and more efficient products.
Building on this foundation, out of all the AI capabilities today, assistive AI emerges as a pivotal solution for the semiconductor industry, propelling it into a new era of efficiency and innovation. Also, as the complexity of semiconductor product design manufacturing increases further, with ever-smaller and ultra-advanced technology process nodes, traditional semiconductor design and manufacturing methodologies begin to falter. It is where assistive AI steps in to bridge this gap.
What is assistive AI
Assistive AI refers to artificial intelligence systems that support and enhance human capabilities, particularly in decision-making, problem-solving, and efficiency improvement tasks. Unlike fully autonomous AI systems that operate independently, assistive AI works alongside humans, providing insights, recommendations, and automation of routine tasks to augment human skills and expertise.
このストーリーは、Electronics For You の April 2024 版からのものです。
Magzter GOLD を購読すると、厳選された何千ものプレミアム記事や、9,500 以上の雑誌や新聞にアクセスできます。
すでに購読者ですか? サインイン
Electronics For You からのその他のストーリー
Electronics For You
Low-power, reliable transmitter chip
Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.
1 min
September 2025

Electronics For You
Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS
Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...
5 mins
September 2025

Electronics For You
Compact swarm-level AI drones navigation using neural network
Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.
1 min
September 2025

Electronics For You
ML-based wireless power transfer
Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.
1 min
September 2025
Electronics For You
Wi-Fi that knows who you are
WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.
1 min
September 2025

Electronics For You
3mm-thick holographic display that delivers lifelike 3D visuals
Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.
1 min
September 2025

Electronics For You
Smart Trolley Robot 'TROLL.E 1.0'
Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.
3 mins
September 2025
Electronics For You
Compact metal-free thin-film supercapacitor delivers 200V
GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.
1 min
September 2025

Electronics For You
Al-powered self-driving lab tests materials 10x faster
Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.
1 min
September 2025

Electronics For You
Breakthrough in co-packaging photonic and electronic chips
The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.
1 min
September 2025
Listen
Translate
Change font size