Breaking New Ground in Wire Bond Inspection with Capacitive Test Methods

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics.

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It enables interconnections between the die and other electronic components in an integrated circuit (IC), such as transistors and resistors. Wire bonding establishes an electrical connection between a chip's bond pad and a corresponding pad on the package substrate or another chip. The semiconductor and electronics manufacturing markets are continuing to expand. A recent report by Fortune Business Insights predicted that the semiconductor market would grow to be worth over 2062.59 US billion dollars by 2032. As demand continues to increase, the importance of testing wire bonds grows in parallel. These connections are crucial in linking the semiconductor die to the package leads or substrate. Any defects in these bonds can lead to issues like open or short circuits, significantly impacting device functionality. Therefore, testing wire bonds is not just about ensuring reliability and reducing production costs but also about guaranteeing compliance with industry standards.

Below are some of the common defects that impact wire bonds:

• Wire sagging: occurs when the wire under tension stretches or sags, leading to inadequate contact and compromised electrical performance.

• Wire sweep: this refers to the lateral movement of the wire during the bonding process, causing misalignment and subsequent unreliable connections.

• Loop formation: unintentional excess wire can result in loop formation, adversely affecting bond quality and device functionality.

• Wire shorts: these are a critical defect where two wires make unintended electrical contact, which could lead to circuit malfunctions or even complete device failure.

• Wire opens: are defects where a wire that should be electrically connected to a pad becomes disconnected, causing an open circuit and disrupting the device's functionality.

Overview of Testing Methods