कोशिश गोल्ड - मुक्त

Monitoring And Automation System FOR LATHE MACHINES

Electronics For You

|

May 2025

This pilot system offers an Arduino-based solution for real-time monitoring and automation of lathe machines, integrating temperature, vibration, and operational data to improve efficiency and safety.

- DR SAURABH TEGE AND YOGESH JATAV

Monitoring And Automation System FOR LATHE MACHINES

Designed to monitor temperature and vibration in real time, the system enables automated alerts and preventive actions to minimise downtime and extend machine life. It also enhances operator convenience by displaying and transmitting data on an LCD via serial communication.

Vibrations are detected through analogue and digital signals, while temperature is measured using an LM35 sensor. Anomalies trigger alerts through a buzzer. Real-time data is shown on a 16x2 LCD display.

The system can be modified for expanded automation to include a relay module that activates external mechanisms. This approach supports predictive maintenance, ensures safe operating conditions, prevents damage, and enhances overall productivity. The prototype is shown in Fig. 1. Refer to the Bill of Materials table to build this system.

EFY note. Although the prototype shown uses an Arduino Uno, the circuit also works with an Arduino Nano, as shown in Fig. 3.

imageCircuit and working

Electronics For You से और कहानियाँ

Electronics For You

Low-power, reliable transmitter chip

Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS

Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...

time to read

5 mins

September 2025

Electronics For You

Electronics For You

Compact swarm-level AI drones navigation using neural network

Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.

time to read

1 min

September 2025

Electronics For You

Electronics For You

ML-based wireless power transfer

Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.

time to read

1 min

September 2025

Electronics For You

Wi-Fi that knows who you are

WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.

time to read

1 min

September 2025

Electronics For You

Electronics For You

3mm-thick holographic display that delivers lifelike 3D visuals

Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Smart Trolley Robot 'TROLL.E 1.0'

Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.

time to read

3 mins

September 2025

Electronics For You

Compact metal-free thin-film supercapacitor delivers 200V

GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Al-powered self-driving lab tests materials 10x faster

Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Breakthrough in co-packaging photonic and electronic chips

The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.

time to read

1 min

September 2025

Listen

Translate

Share

-
+

Change font size