The convergence race: Reshaping the wireless future

Multi-protocol wireless integration is redefining the lot landscape, reshaping semiconductor strategy and determining who leads the next wave of global connectivity.

- BY NIKUL SHAH

The global wireless ecosystem is entering a defining phase. As billions of IoT devices connect across various industries, the demand for chips that can efficiently handle multiple wireless protocols, such as WiFi 6, Bluetooth Low Energy (BLE), and LoRa, is increasing rapidly.

This convergence of technologies is creating a competitive landscape where the focus is shifting from speed and range to integration, efficiency, and adaptability. The evolution of multi-protocol wireless modules is not only reshaping the semiconductor value chain but also determining the future leadership in the IoT connectivity space.

A GROWING WAVE OF CONNECTIVITY

The growth trajectory of connected devices continues to rise sharply. According to market research, the global IoT chipset market, encompassing sensors, processors, and connectivity, was valued at approximately USD 605.6 billion in 2024 and is projected to reach USD 1,662.6 billion by 2032, growing at a compound annual growth rate (CAGR) of 13.5%. Within this segment, the WiFi IoT chipset market alone is projected to increase from USD 1.85 billion in 2024 to USD 4.84 billion by 2030, reflecting a CAGR of 17.3 per cent. Similarly, the LoRa chipset market is expected to expand from USD 0.25 billion in 2024 to nearly USD 2.8 billion by 2033, indicating a CAGR of around 28.5 per cent.

These figures illustrate that the future of IoT connectivity lies in combining multiple wireless standards. Each technology addresses a distinct use case. WiFi offers high throughput for data-heavy applications, BLE enables energy-efficient short-range communication, and LoRa facilitates long-range, low-power transmission. The ability to merge these protocols within a single RF module is rapidly becoming a decisive factor in meeting the performance and cost expectations of connected products.

PUSH FOR MULTI-PROTOCOL INTEGRATION