Precision, Intelligence and the Future of Electronics Manufacturing

Once a production innovation, Surface-Mount Technology (SMT) has become the foundation of modern electronics manufacturing. With advances in automation, materials, and digital integration, SMT is driving the next era of miniaturised, high-performance, and intelligent electronics assembly.

- Arun Bhardwaj, Editorial Director

From a production novelty, Surface-Mount Technology has quietly evolved into the backbone of modern electronics manufacturing. In 2025, placing tiny chips on a board and reflowing solder is now very different, with the discipline spanning ultra-fine pitch placement, advanced packaging interfaces, intelligent inspection, and factory-level digitalisation. These developments are changing the way designers, contract manufacturers, and OEMs think about reliability, yield, and time to market.

Market Momentum and Commercial Drivers

Demand for ever-smaller, higher-performance devices from 5G and edge AI modules to automotive domain controllers is driving continued investment in SMT equipment and services. The market for SMT equipment itself is growing as manufacturers upgrade lines for higher accuracy, faster changeovers and better process control. That commercial momentum is visible in market forecasts and growth in equipment sales as suppliers race to support miniaturisation and higher throughput.

Placement: Speed, Accuracy and Adaptive Handling

Pick-and-place machines remain the heart of any SMT line, but the technology is rapidly advancing. Modern heads combine high-speed gantries with multiple independent placement modules and adaptive vision systems that correct for component skew in real time.

Vacuum handling, more sophisticated nozzle arrays, and automatic tool-change routines let lines cope with everything from micro-BGAs and wafer-level packages to large, oblong power parts without sacrificing cycle time. The latest machines also offer deterministic placement accuracy at sub-20µm tolerances, facilitating denser board layouts and finer pitches.

Soldering and Thermal Control: Finer Profiles, Gentler Heat