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Big Scope For Indo-German Electronics R&D Partnership: Prof. Dr. Kutter

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February 2017

The German Fraunhofer Research Institution for Microsystems and Solid State Technology (Fraunhofer EMFT) stands for applied research into sensors and actuators for people and the environment. Its competencies include: Functional Molecules, Silicon Technologies, Devices and 3D Integration, Foil Technologies, Micropumps and Design, Test & System Integration. Each of these competences in its own right allows new kinds of sensors and actuators to be created. Prof. Dr. rer. nat. Christoph Kutter, Director Fraunhofer EMFT, in a question and answer session, said that, “The German R&D landscape has a strong background in most of these areas, especially in the fields of sensor, analogue, opto and power technologies. India is very strong in software development and in integrated chip design. Bringing together these competences holds great potential for successful R&D collaboration between the 2 countries.” The excerpts:

Big Scope For Indo-German Electronics R&D Partnership: Prof. Dr. Kutter

Q: What are the emerging trends in the field of microelectronics globally?

Prof. Kutter: According to the recently published high tech strategy of the German federal government, the following trends will be shaping the future of microelectronics: Multifunctional electronic systems and system integration technologies; Power electronics for energy efficiency;- Innovative tools for chip and system design; Chip-based security technologies; Novel production technologies – precise, reliable and cost-efficient.

Innovation and research activities in these areas are mandatory for tackling the ground challenges facing our society on a global scale today and in the future.

Q: What are the prospects for Indo- German collaboration in this field?

Prof. Kutter: The German R&D landscape has a strong background in most of these areas, especially in the fields of sensor, analogue, opto and power technologies. India is very strong in software development and in integrated chip design. Bringing together these competences holds great potential for successful R&D collaboration between the 2 countries. Such activities could be supported by suitable bilateral research programmes and targeted technology transfer undertakings.

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