Push to electronics manufacturing

PRESS NOTE 3 EASING EXPECTED TO UNLOCK TECHNOLOGY TIE-UPS

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THE EASING OF investment restrictions under Press Note 3 is expected to give a fresh push to India’s electronics manufacturing ambitions by enabling faster technology tie-ups and minority investments in component manufacturing.

Industry executives and analysts told FE that the changes could complement the recently launched electronics components manufacturing scheme (ECMS), which aims to deepen domestic production of components and materials used in electronic devices. The scheme has an outlay of ₹40,000 crore and targets segments such as passive components, printed circuit boards and semiconductor supply chain materials.

Industry executives said the new PN 3 framework could ease collaborations between Indian manufacturers and global technology providers, particularly in upstream electronics manufacturing.