Henkel's Advances in Semiconductor Packaging: Reliable & Sustainable Solutions

Henkel is a global leader in industrial and consumer adhesives, offering innovative materials and solutions for sectors like automotive, electronics, and consumer goods.

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During an interaction with Vidushi, Ram Trichur, Market Segment Head of Semiconductor Packaging, Henkel Adhesive Technologies and Zack Lee, Market Segment Head of Consumer Electronics, Henkel Adhesive Technologies discussed Henkel's advancements in semiconductor packaging materials, addressing reliability and performance needs in automotive, AI, and consumer electronics, while emphasizing thermal management, miniaturization, and sustainability efforts across diverse applications.

What key materials and innovations have enabled Henkel's wirebond packaging to meet the automotive industry's reliability and performance standards?

Henkel has an extensive portfolio of semiconductor packaging materials for wirebond packaging applications in automotive applications. Some key areas include automotive CMOS image sensors (CIS) applications, which are served using our die attach paste and encapsulation materials to mitigate package stress and serve the needs of evolving larger body CIS packages. In power conversion applications using FETs, we have a portfolio of high thermal sintering die attach solutions that deliver -200W/mK thermal conductivity and high adhesion to multiple leadframe and die backside surfaces. We also carry a portfolio of die attach film products that used to support Analog ICs and MCUs in automotive applications.

How is Henkel addressing the challenges of flip-chip, fan-in/fan-out WLP, and 2.5D/3D packaging in advanced semiconductor architectures?