Versuchen GOLD - Frei

EXPANDING DATA CAPACITY: Merging SDM And WDM Technologies

Electronics For You

|

December 2024

The integration of multicore fibre and multiband optical networks could redefine data transmission, meeting our growing appetite for speed and capacity.

- ARKA MUKHERJEE, SURYANSH PRATAP SINGH

EXPANDING DATA CAPACITY: Merging SDM And WDM Technologies

SURYANSH PRATAP SINGH is a Scientist 'B' at the Centre for Development of Telematics (C-DOT), the research and development centre of the Government of India. He earned his B.Tech degree in Electronics and Communication Engineering from MNNIT Allahabad.

ARKA MUKHERJEE is a Scientist 'E' and Team Leader at the Centre for Development of Telematics (C-DOT), the research and development centre of the Government of India. He possesses over 12 years of experience in designing embedded systems for optical access networks and quantum key distribution systems.

With over 65% of the global population now connected to the internet, data demand has surged to unprecedented levels. This relentless growth is fuelled by high-definition video streaming, extensive cloud computing, IoT, high-resolution multiplayer gaming, real-time online transactions, VR, and AR. Data transfer relies on three primary mediums: optical cables, copper cables, and wireless. While copper and wireless media suit short- to medium-range networks, optical fibre networks span thousands of miles, connecting cities, countries, and continents. The rapid expansion of internet users has pushed existing optical fibre infrastructure to its limits, necessitating the adoption of advanced technologies to meet future data needs.

Optical fibre: An overview An optical fibre carries information signals as light pulses in the near-infrared spectrum and consists of multiple layers (Fig. 1):

Core. The central internal layer of an optical fibre through which light propagates. It is typically composed of high-purity glass and has a higher refractive index than the cladding

Cladding.

WEITERE GESCHICHTEN VON Electronics For You

Electronics For You

Low-power, reliable transmitter chip

Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS

Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...

time to read

5 mins

September 2025

Electronics For You

Electronics For You

Compact swarm-level AI drones navigation using neural network

Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.

time to read

1 min

September 2025

Electronics For You

Electronics For You

ML-based wireless power transfer

Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.

time to read

1 min

September 2025

Electronics For You

Wi-Fi that knows who you are

WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.

time to read

1 min

September 2025

Electronics For You

Electronics For You

3mm-thick holographic display that delivers lifelike 3D visuals

Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Smart Trolley Robot 'TROLL.E 1.0'

Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.

time to read

3 mins

September 2025

Electronics For You

Compact metal-free thin-film supercapacitor delivers 200V

GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Al-powered self-driving lab tests materials 10x faster

Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Breakthrough in co-packaging photonic and electronic chips

The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.

time to read

1 min

September 2025

Listen

Translate

Share

-
+

Change font size