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Fast-curing SMD adhesive for precise dispensing
COATINGS AND ANTI CORROSION ENGINEERING REVIEW
|August/September 2023
Panacol (panacol.com) presents its new Structalit 5604, an extremely fastcuring adhesive which is specifically developed for bonding SMDs to printed circuit boards.
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The adhesive is based on epoxy resin and is, despite its high viscosity, suitable for jet application, notes a press communique from the company. Structalit 5604 is a one-component epoxy resin adhesive that contrasts well with green PCB material due to its red color. This makes it possible to ensure visual inline inspection. The one-component adhesive can be dispensed in production through jetting, valve di
Diese Geschichte stammt aus der August/September 2023-Ausgabe von COATINGS AND ANTI CORROSION ENGINEERING REVIEW.
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