يحاول ذهب - حر

RefillBot: making utility management devices smart

September 2022

|

Electronics For You

RefillBot’s IoT solution makes operation scaling of smart devices easy. With compatible hardware and software supported by API, this startup has seen a 100% success rate of being deployed in 100 villages within 8 months

- Sharon Abhignya Katta

RefillBot: making utility management devices smart

In spite of the immense number of offerings in the Internet-of-Things (IoT) field and inline business models, utility management still requires human intervention at one place or the other. Even though the concept of digitisation helped during the pandemic, human intervention could not be avoided.

Here is where RefillBot, a Bengaluru based startup, steps in with its IoT solution. Started in the year 2020, RefillBot is a B2B company that provides a set of IoT hardware and software which can fit into the infrastructure of utilities. The data is automated across a unified dashboard and can be used to simplify, improve, and scale operations.

The company has three product lines: water monitoring, payments, and sustainable packaging. The utility that is currently being focused on is water. “Even though there are implementational, operational, and maintenance agencies, water management companies require a person to handle the data on a day-to-day basis. Our solution helps avoid even this cost for these agencies.”

المزيد من القصص من Electronics For You

Electronics For You

Low-power, reliable transmitter chip

Researchers at MIT (United States) have developed a compact transmitter chip that reduces signal errors by a factor of four and extends battery life for IoT devices.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Leading Suppliers of MICROSCOPES FOR OC OF ELECTRONICS

Who are India's Leading Suppliers of Microscopes for Quality Control of Electronics? Here is the list...

time to read

5 mins

September 2025

Electronics For You

Electronics For You

Compact swarm-level AI drones navigation using neural network

Researchers at Shanghai Jiao Tong University (Shanghai, China) have developed a compact AI navigation system for drones.

time to read

1 min

September 2025

Electronics For You

Electronics For You

ML-based wireless power transfer

Researchers at Chiba University (Chiba, Japan) have developed a machine learning-based method to design wireless power transfer (WPT) systems that stay efficient and stable across varying loads.

time to read

1 min

September 2025

Electronics For You

Wi-Fi that knows who you are

WhoFi, developed at La Sapienza University (Rome, Italy), is a Wi-Fi-based surveillance system that identifies individuals by how their bodies disrupt wireless signals; no cameras, contact, or consent is needed.

time to read

1 min

September 2025

Electronics For You

Electronics For You

3mm-thick holographic display that delivers lifelike 3D visuals

Stanford researchers (California) have unveiled a 3mm-thick holographic display that delivers lifelike 3D visuals using true holography, not stereoscopy.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Smart Trolley Robot 'TROLL.E 1.0'

Robots now play a vital role across modern society, often described as human-like due to their growing presence in social and commercial environments.

time to read

3 mins

September 2025

Electronics For You

Compact metal-free thin-film supercapacitor delivers 200V

GDUT (Guangzhou, China )researchers have developed a metal-free thin-film supercapacitor (TFSC) stack that delivers 200V in just 3.8cm³.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Al-powered self-driving lab tests materials 10x faster

Researchers at NC State (Raleigh, North Carolina) have developed an Al-powered self-driving lab that uses dynamicstate flow and real-time data to test materials 10x faster than traditional labs.

time to read

1 min

September 2025

Electronics For You

Electronics For You

Breakthrough in co-packaging photonic and electronic chips

The MIT (United States) FUTUR-IC team has developed a breakthrough chip packaging method that co-integrates electronics and photonics using passive alignment.

time to read

1 min

September 2025

Translate

Share

-
+

Change font size