MediaTek Dimensity 900 5G Chipset to Power Mid-Range Smartphones
My Mobile|June 2021
The devices using this SoC are expected to arrive in the second quarter of 2021

Fabless semiconductor major MediaTek recently introduced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Density 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays, and a 108MP main camera for an all-around incredible experience.

“Dimensity 900 brings a suite of connectivity, display, and 4K HDR visual enhancements to mid-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business unit. “The chipset’s support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity,” Hsu added.

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