With a great success of NEPCON Japan 2019, the 34th Edition of Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology, NEPCON Japan Tokyo is all set to draw the board from January 15-17, 2020, where 2,000 exhibitors will be showcasing latest trends and technology in the fields of SMT, Testing Technology, Packaging Technology, Electronic Components & Materials, Fine Process Technology, LED & Laser Diode Technology and PCBs.
Moreover, NEPCON Japan Tokyo is a compound exhibition, which will combine seven shows including the 34th Internepcon Japan, 34th Electrotest Japan, 21st IC & Sensor Packaging Technology Expo, 21st Electronic Components and Materials Expo, PWB Expo, 21st Printed Wiring Boards Expo, 12th LED and Laser Diode Technology Expo and 10th Fine Process Technology Expo. Around 70,000 visitors are expected to attend the event this year.
In addition, NEPCON Japan has been concurrent with the following shows. Automotive World: is a leading exhibition for advanced automotive technologies, covering topics such as automotive electronics, connected car, autonomous driving, EV/HEV/FCV, lightweight and processing technology and Technical Conference.
34th NEPCON Japan 2020 will bring together, the Plant Managers, Production, Electronic Business Investors, Purchasing, Process Development, State Officials, Procurement, General Management, Production & Assembly, Manufacturing, Test & Inspection, Research & Development, Marketing, Government Officials, Research & Planning, Dealers, Technical Engineer, Design & Packaging and Quality Control, under one roof.
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